Parallel link mechanism, exposure system and method of...

Photocopying – Projection printing and copying cameras – Step and repeat

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C355S072000, C355S075000

Reexamination Certificate

active

06940582

ABSTRACT:
A reticle base level block to support a reticle stage for holding a reticle, a wafer base level block to support a wafer stage for holding a wafer, and the like are supported to be independent of other portions and be controllable in their attitudes by parallel link mechanisms each including at least three expandable rods. Therefore, the portions supported by the parallel link mechanism can be made lightweight using the advantages of the parallel link mechanism, and the attitudes of those can be precisely controlled with excellent operational-characteristics and high rigidity. In addition, transmission of vibrations and the like between the reticle base level block, the wafer base level block and other portions, e.g. an optical projection system, can be prevented. Therefore, a fine pattern formed on the reticle can be precisely transferred onto the wafer.

REFERENCES:
patent: 5005492 (1991-04-01), Ogino et al.
patent: 5203199 (1993-04-01), Henderson et al.
patent: 5241188 (1993-08-01), Mizutani
patent: 5545962 (1996-08-01), Wakui
patent: 5559584 (1996-09-01), Miyaji et al.
patent: 5677824 (1997-10-01), Harashima et al.
patent: 5746138 (1998-05-01), Hirose
patent: 5969876 (1999-10-01), Kreitzer et al.
patent: 6048750 (2000-04-01), Hembree
patent: 6255796 (2001-07-01), Ebihara et al.
patent: 6283361 (2001-09-01), Maki et al.
patent: 6327026 (2001-12-01), Wakui
patent: 6359688 (2002-03-01), Akimoto et al.
patent: 6400444 (2002-06-01), Suzuki
patent: 391 773 (1990-11-01), None
patent: 0 760 272 (1997-03-01), None
patent: 62226435 (1987-10-01), None
patent: 04250988 (1992-09-01), None
patent: 10-260277 (1998-09-01), None
patent: 11-274031 (1999-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Parallel link mechanism, exposure system and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Parallel link mechanism, exposure system and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Parallel link mechanism, exposure system and method of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3412149

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.