Parallel heat exchanger for a component in a mobile system

Details Parallel heat exchanger for a component in a mobile system Parallel heat exchanger for a component in a mobile system

2005-06-07

2005-06-07

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S015200, C165S080300, C165S104330, C165S185000, C165S121000, C165S126000, C165SDIG119, C361S695000, C257S715000, C257S722000

Reexamination Certificate

active

06903930

ABSTRACT:
A system and a method for using parallel heat exchangers to disperse heat from a mobile computing system are disclosed. In one possible embodiment, multiple heat exchangers are thermally coupled to a thermal attach platform. Multiple remote heat exchangers may be thermally coupled to the thermal attach platform using a heat pipe for each remote heat exchanger or a single heat pipe for all the remote heat exchangers. In one embodiment, the thermal attach platform may be a copper block or a heat pipe chamber. An air circulation unit may be coupled adjacent to each remote heat exchanger. Direct attachment heat exchangers may be directly attached to the thermal attach platform. An air circulation unit, such as a fan, may be coupled adjacent to the direct attachment heat exchanger, either vertically or horizontally.

REFERENCES:
patent: 6105662 (2000-08-01), Suzuki
patent: 6226178 (2001-05-01), Broder et al.
patent: 6400565 (2002-06-01), Shabbir et al.
patent: 6437983 (2002-08-01), Machiroutu et al.
patent: 6712129 (2004-03-01), Lee

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