Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-01-31
2006-01-31
Chérvinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S711000, C257S714000, C165S080400
Reexamination Certificate
active
06992888
ABSTRACT:
A module includes a cold plate. Solid-state heat sources are thermally mounted on the cold plate in a chamber defined by the cold plate and a lid. Cooling of the heat sources is enhanced by a dielectric liquid within the chamber. The liquid has a boiling point slightly below the temperatures of “hot” spots, to form small bubbles during operation, which enhance convection flow. The liquid may be a mixture of fluorocarbons of different boiling points. The liquid may contain diamond particles.
REFERENCES:
patent: 4762174 (1988-08-01), Artus
patent: 4764845 (1988-08-01), Artus
patent: 5270572 (1993-12-01), Nakajima et al.
patent: 5305184 (1994-04-01), Andresen et al.
patent: 5373417 (1994-12-01), Barrett
patent: 5459474 (1995-10-01), Mattioli et al.
patent: 6175501 (2001-01-01), Bortolini et al.
patent: 6388317 (2002-05-01), Reese
patent: 6465730 (2002-10-01), Pluymers et al.
patent: 6695974 (2004-02-01), Withers et al.
patent: 6819561 (2004-11-01), Hartzell et al.
Chervinsky Boris
Duane Morris LLP
Lockheed Martin Corporation
LandOfFree
Parallel cooling of heat source mounted on a heat sink by... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Parallel cooling of heat source mounted on a heat sink by..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Parallel cooling of heat source mounted on a heat sink by... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3544063