Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2007-11-27
2007-11-27
Dickey, Thomas L. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S027000, C361S306100
Reexamination Certificate
active
11159733
ABSTRACT:
Disclosed herein is a parallel capacitor of a semiconductor device. According to the present invention, a first capacitor and a second capacitor are formed in different layers of the same region, wherein a metal layer connected to an upper electrode of the first capacitor is formed in the same layer as a metal layer connected to a lower electrode of the second capacitor. Thus, twp capacitors can be connected in parallel only with a metal layer composed of three layers. Accordingly, the present invention is advantageous in that it can reduce process steps for forming multiple metal layers, lower a step and cut manufacture cost.
REFERENCES:
patent: 5583359 (1996-12-01), Ng et al.
patent: 2004/0126981 (2004-07-01), Rao et al.
patent: 2005/0121744 (2005-06-01), Chang et al.
Dickey Thomas L.
Magnachip Semiconductor Ltd.
Marshall & Gerstein & Borun LLP
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