Paper attachment method

Details Paper attachment method Paper attachment method

2011-05-24

2011-05-24

Osele, Mark A (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S289000, C156S291000, C428S040100, C428S041800

Reexamination Certificate

active

07947144

ABSTRACT:
A paper attachment system and method includes providing a plurality of flexible panels. Each of the flexible panels has a first side, a second side and a peripheral edge. A plurality of adhesive patches is provided. Each of the panels has one of the adhesive patches attached thereto. The adhesive patches are positioned on the first sides of the panels. A plurality of coverings is provided. Each of the coverings is positioned on and removably attached to one of the adhesive patches so that each of the adhesive patches is covered by one of the coverings. A plurality of the panels is positioned on top of each other to define a stack of the panels. The coverings are then removed from the stack of the panels. Pressure is then applied to the stack of panels to releasably secure the panels together with the adhesive patches.

REFERENCES:
patent: 3691140 (1972-09-01), Slvor
patent: 4447481 (1984-05-01), Holmberg et al.
patent: 4979237 (1990-12-01), Hazar et al.
patent: 4980212 (1990-12-01), Marquis et al.
patent: 5413381 (1995-05-01), Beeuwkes, III et al.
patent: 5716685 (1998-02-01), Kumar et al.
patent: 5967555 (1999-10-01), Samelian
patent: 6071584 (2000-06-01), Ritter
patent: 6153278 (2000-11-01), Timmerman et al.
patent: 6159497 (2000-12-01), LaPrade et al.
patent: 6544640 (2003-04-01), Miles et al.
patent: 6703096 (2004-03-01), Sabella
patent: 7037564 (2006-05-01), Abron

Affiliated with

Also associated with

Rating

Paper attachment method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Paper attachment method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Paper attachment method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2708005