Panel-to-panel lamination method for improved uniformity

Details Panel-to-panel lamination method for improved uniformity Panel-to-panel lamination method for improved uniformity

2005-08-30

2008-10-14

Aftergut, Jeff H (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S087000, C156S285000, C156S295000, C156S580000

Reexamination Certificate

active

07435311

ABSTRACT:
A method of adhering a first panel, such as an OLED assembly, to a second panel, such as a protective cover plate, is disclosed. An adhesive is applied to a face of at least one of the first and second panels. The first panel is positioned to be responsive to movement of any of a plurality of independently controlled expandable elements. The second panel is held adjacent the first panel. At least one of the expandable elements is selectively expanded so that a first edge of the first panel contacts a first edge of the second panel. The expandable elements are further selectively expanded so that the adhesive fully contacts the first and second panels.

REFERENCES:
patent: 5273553 (1993-12-01), Hoshi et al.
patent: 5592288 (1997-01-01), Sampica et al.
patent: 5942062 (1999-08-01), Hassall et al.
patent: 2002/0179229 (2002-12-01), Chuzles

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