Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1999-02-10
2000-08-29
Thomas, Alexander S.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156185, 428 69, 428167, B32B 3118, B32B 3114, B32B 3126
Patent
active
061103101
ABSTRACT:
The invention relates to a panel-shaped, evacuated and thermally insulating molded element which contains pressed and optionally hardened, microporous insulating material, wherein the insulating material is in one or more sheathed and evacuated layers, and the molded element has a surface with a lamellar structure, the lamellae being produced by elongate incisions into the surface and having a depth of 40 to 95% of the thickness of the molded element. The invention also relates to a method of insulation for curved surfaces with thermally insulating material, wherein the molded element is made to fit with the surface with a lamellar structure snugly against the curved surface, is fixed in position, and the vacuum is destroyed in at least one layer.
REFERENCES:
patent: 4505977 (1985-03-01), Hasenauer et al.
patent: 5445857 (1995-08-01), Nowobilski
patent: 5843353 (1998-12-01), Vos et al.
patent: 5900299 (1999-05-01), Wynne
English Abstract corresponding to DE 36 30 399.
English Abstract corresponding to DE 196 52 731.
English Abstract corresponding to DE 44 32 896.
English Abstract corresponding to DE 44 32 896 A1.
Eyhorn Thomas
Klaus Johann
Kratel Gunter
van Gucht Baudewijn
Thomas Alexander S.
Wacker-Chemie GmbH
LandOfFree
Panel-shaped, evacuated molded element, method of thermal insula does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Panel-shaped, evacuated molded element, method of thermal insula, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Panel-shaped, evacuated molded element, method of thermal insula will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1245697