Panel level methods and systems for packaging integrated...

Details Panel level methods and systems for packaging integrated... Panel level methods and systems for packaging integrated...

2011-08-16

2011-08-16

Fahmy, Wael M (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S122000, C438S123000, C257S712000, C257SE21502

Reexamination Certificate

active

07998791

ABSTRACT:
Panel level methods and arrangements are described for attaching heat sinks in panel form with dice attached to a leadframe panel. Various methods produce integrated circuit packages each having an exposed heat sink on one outer surface of the package and an exposed die attach pad on a second opposite surface of the package.

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