Panel construction for housing keypads of mobile computing...

Details Panel construction for housing keypads of mobile computing... Panel construction for housing keypads of mobile computing...

2008-01-16

2011-10-25

Bost, Dwayne (Department: 2617)

Telecommunications

Transmitter and receiver at same station

Radiotelephone equipment detail

C455S550100, C361S679080, C361S679090, C379S433010, C379S433070, C345S169000, CD14S346000

Reexamination Certificate

active

08046032

ABSTRACT:
A computing device includes a housing, a front housing segment, a keypad assembly and a rigid panel. The front housing segment includes a void. The keypad assembly includes a substrate and a key structure layer. The key structured layer includes a plurality of key structures. The keypad assembly is configured to extend the key structure layer at least partially through the void so as to enable user access to the individual key structures of the key structure layer. A rigid panel is structured to secure to the front housing segment so as to combine with the key structure layer. The panel includes an arrangement of cross-members that define openings, where each opening is dimensioned to fit around at least one key structure of the key structure layer.

REFERENCES:
patent: 5612692 (1997-03-01), Dugas et al.
patent: 6488425 (2002-12-01), Spence et al.
patent: 6614905 (2003-09-01), Kristensen
patent: 7330216 (2008-02-01), Purdy et al.
patent: 2006/0177047 (2006-08-01), Grudzinski et al.
patent: 2006/0188091 (2006-08-01), Chen
patent: 2007/0298828 (2007-12-01), Begic et al.

Affiliated with

Also associated with

Rating

Panel construction for housing keypads of mobile computing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Panel construction for housing keypads of mobile computing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Panel construction for housing keypads of mobile computing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4265463