Panel board

Electricity: electrical systems and devices – Miscellaneous

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

174255, 174261, 361409, 361414, 361417, 361419, 439 70, H05K 702

Patent

active

051595362

ABSTRACT:
A multilayer panel board for mounting electronic components that have respectively different voltage requirements at specific leads of the components; in the board, conductive layers carry the different voltages across the board; terminals at locations across the board receive leads of the electronic components, some of these terminals being electrically connected directly to selected conductive layers at the locations to deliver corresponding voltages from the conductive layers to the specific leads; and the terminals are arranged in a pattern that permits at least one common region of the board to be occupied at a given time by any one of at least two different types of electronic components having respectively different voltage requirements, with the voltage requirements of the electronic component at the specific leads being served directly from the conductive layers via the terminals, whereby the common region need not be committed in advance to serve only one type of electronic component. In another aspect, a multilayer panel board has rows and columns of electrical socket terminals for receiving component pins; at least some of the rows are spaced apart from the next adjacent row by a spacing that is the same as the spacing between the parallel rows of pins of one type of component, and at least some of the columns are spaced apart from the next adjacent column by a spacing that is the same as the spacing between the parallel rows of pins of another type of component. In another aspect, at least one exposed conductive layer includes an electrically isolated region that can be dedicated to a voltage different from the remainder of the conductive layer.

REFERENCES:
patent: 3250848 (1966-05-01), Beelitz et al.
patent: 3324224 (1967-06-01), Thibodeau
patent: 3325766 (1967-06-01), Kolb et al.
patent: 3344515 (1967-10-01), Schuster et al.
patent: 3372310 (1968-03-01), Kantor
patent: 3516156 (1970-06-01), Steranko
patent: 3519959 (1970-07-01), Bewley et al.
patent: 3568000 (1971-03-01), D'Aboville et al.
patent: 3680005 (1972-07-01), Jorgensen et al.
patent: 3891898 (1975-06-01), Damon
patent: 3895435 (1975-07-01), Turner et al.
patent: 3927925 (1975-12-01), Borsuk
patent: 3932932 (1976-01-01), Goodman
patent: 4004196 (1977-01-01), Doucet
patent: 4054939 (1977-10-01), Ammon
patent: 4295182 (1981-11-01), Aubusson et al.
patent: 4330684 (1982-05-01), Hayward
patent: 4362899 (1982-12-01), Borrill
patent: 4434321 (1984-02-01), Betts
patent: 4494172 (1985-01-01), Leary et al.
patent: 4498122 (1985-02-01), Rainal
patent: 4524240 (1985-06-01), Stock et al.
patent: 4602271 (1986-07-01), Dougherty, Jr. et al.
patent: 4675789 (1987-06-01), Kuwabara et al.
patent: 4688151 (1987-08-01), Kraus et al.
patent: 4736266 (1988-04-01), Tanibe
patent: 4754371 (1988-06-01), Nitta et al.
patent: 4799128 (1989-01-01), Cheu
patent: 4803595 (1989-02-01), Kraus et al.
Mupac, High Speed Packaging Systems, Catalog (1984-85).
Mupac, Pin Grid Array & Dip Sockets, Catalog (1987).
Visco, A., "Coaxing top bipolar speeds from prototyping boards", Electronic Products Magazine, Sep., 1987.
Chapman, et al., "Ultra-High Performance Wire Wrap Boards", Sep., 1987.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Panel board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Panel board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Panel board will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-910584

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.