Panel based on polycondensable resin and a method for the manufa

Details Panel based on polycondensable resin and a method for the manufa Panel based on polycondensable resin and a method for the manufa

1979-01-11

1981-03-17

Anderson, Philip

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

264 453, 264 466, 264101, 264DIG2, 264DIG6, 264DIG7, 428 71, 428313, 428406, 521 54, 521181, B32B 520, B32B 1704, B32B 2318, B29D 2704

Patent

active

042568030

ABSTRACT:
A panel comprising fillers embedded in a closed cell expanded phenolic resin is made by making a mixture, which is initially fluid, or phenolic resin, a hardening agent, a surface active agent and a porogenic agent, which has a boiling point above ambient temperature and below the polycondensation temperature of the mixture. This liquid mixture is mixed with fillers, for example balls or microspheres of glass or expanded material such as polystyrene. The resulting mixture is placed in a mould, only partially filling the mould, and heated progressively to a temperature in the neighborhood of the boiling point of the porogene agent, while evacuating the mould, and held at that temperature until the mixture has expanded to fill the mould. The temperature is then progressively increased to the polycondensation temperature to harden the expanded mixture.

REFERENCES:
patent: 2376653 (1945-05-01), Boyer
patent: 2582228 (1952-01-01), Brinkema
patent: 3557263 (1971-01-01), Marra
patent: 4130614 (1978-12-01), Saidla

Affiliated with

Also associated with

Rating

Panel based on polycondensable resin and a method for the manufa does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Panel based on polycondensable resin and a method for the manufa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Panel based on polycondensable resin and a method for the manufa will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1646501