Panel assembly structure capable of connecting wiring line with

Details Panel assembly structure capable of connecting wiring line with Panel assembly structure capable of connecting wiring line with

1995-07-24

1997-09-16

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361767, 361771, 439 91, 349150, H05K 702, H05K 706

Patent

active

056687001

ABSTRACT:
There is provided a highly reliable panel assembly structure capable of performing fine-pitch high-density assembling at a high yield and a low cost. A flexible wiring board has a film-like substrate with flexibility, and an IC chip is mounted in an area. In the area is provided a through hole that has plane dimensions smaller than plane dimensions of the chip and penetrates the substrate. Portions that belong respectively to an output side wiring line and an input side wiring line provided on a substrate surface and are connected respectively to an output side electrode and an input side electrode of the chip via second connection materials and are supported by the substrate surface. An output terminal of the flexible wiring board is connected to an electrode terminal formed at a peripheral portion of a panel via a first connection material, while an input terminal of the flexible wiring board is connected to an electrode terminal of a circuit board via a third connection material.

REFERENCES:
patent: 4644445 (1987-02-01), Sakuma
patent: 5001302 (1991-03-01), Atsumi
patent: 5042919 (1991-08-01), Yabu et al.
patent: 5089750 (1992-02-01), Hatada et al.
patent: 5161009 (1992-11-01), Tanoi et al.
patent: 5180888 (1993-01-01), Sugiyama et al.
Semiconductor World, 93 special No., pp. 249-252, Kenzou Hatada, "Driver IC assembling technique".

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