Palladium welding of a semiconductor body

Details Palladium welding of a semiconductor body Palladium welding of a semiconductor body

1991-08-14

1993-11-16

Fourson, George

Fishing, trapping, and vermin destroying

437245, 437966, 148DIG12, 148DIG135, 2281231, 228903, 228208, 22826261, H01C 2184

Patent

active

052623475

ABSTRACT:
A method of bonding together two dissimilar planar bodies, one of which is a semiconductor. A film of palladium is deposited on one of the bodies. The two bodies are pressed together with moderate force with the palladium in between. The palladium chemically reacts with the semiconductor and, at least in the case of GaAs, dissolves the surface oxide and forms a crystalline palladium/semiconductor product topotaxial with the semiconductor.

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