Palladium surface coating suitable for wirebonding and process f

Details Palladium surface coating suitable for wirebonding and process f Palladium surface coating suitable for wirebonding and process f

1998-06-10

2000-10-31

Zimmerman, John J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

205148, 205265, 428637, 428668, 428670, 428671, 428675, 428680, 428926, 428935, B32B 1500, C25D 510

Patent

active

061399779

ABSTRACT:
A surface finish which provides improved wirebonding performance for integrated circuit packages is disclosed. The surface finish which is formed on a substrate includes a palladium layer and one or more material layers. The one or more material layers are interposed between the substrate and the palladium layer. The palladium layer has a hardness that is less than about 500 (KHN.sub.50) while at least one material layer has a hardness that is less than about 250 (KHN.sub.50).

REFERENCES:
patent: 4545868 (1985-10-01), Martin et al.
patent: 4785137 (1988-11-01), Samuels
patent: 4911799 (1990-03-01), Abys, et al.
patent: 5675177 (1997-10-01), Abys et al.

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