Palladium sulfate solution for the selective seeding of the meta

Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener

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427304, 427305, 427437, 427438, 4274431, C23C 2600

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active

053805607

ABSTRACT:
A method of selectively seeding or activating metal interconnections patterned on polyimide dielectric surfaces using an aqueous solution of palladium sulfate, palladium perchlorate, palladium trifluoromethane sulfonate, palladium nitrate or other palladium salts having poorly coordinating counter ions. This strongly selective seeding and the corresponding ability to reliably remove all traces of the seeding material from the polyimide surface eliminates shorting, bridging and reduction of breakdown voltage during electroless plating of a thin layer of nickel or cobalt.

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"Polyimide/Metal Interface of Microelectronic Devices"; J. Kim et al; IBM T. J. Watson Research Center; pp. 1-3.

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