Palladium plating solution, palladium plating film formed using

Details Palladium plating solution, palladium plating film formed using Palladium plating solution, palladium plating film formed using

1998-05-21

2000-12-12

Mayekar, Kishor

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

205265, B32B 1501

Patent

active

06159623&

ABSTRACT:
A palladium plating film having excellent soldering characteristics, including excellent solder wettability, high solder wetting speed, and especially the maintenance of these characteristics in a high-temperature atmosphere, is produced by using a palladium plating solution. The palladium plating film can be used, for example, for the plating of electrical and electronic parts. The palladium plating solution used contains a soluble palladium salt and a quaternary compound, and, if necessary, further contains a pyridine derivative or a salt thereof, and optionally further contains at least one compound selected from ammonium chloride, ammonium hydrogenphosphate, ammonium nitrate, ammonium sulfate, ammonium chloride and boric acid or a soluble selenium salt.

REFERENCES:
patent: 3972787 (1976-08-01), Nobet et al.
patent: 4463060 (1984-07-01), Updegraff
patent: 4849303 (1989-07-01), Graham et al.

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