Palladium plating prodedure

Chemistry: electrical and wave energy – Processes and products

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Details

204 431, 204 446, 204 47, C25D 352, C25D 356, C25D 358, C25D 364

Patent

active

044862741

ABSTRACT:
A palladium electroplating procedure is disclosed which permits rapid and efficient plating and yields ductile, adherent palladium films. The electroplating bath comprises a unique palladium complex. The procedure is also useful for electroplating a variety of palladium alloys. In addition, the bath is highly stable and does not adversely affect the base material being plated.

REFERENCES:
patent: 2452308 (1948-10-01), Lambros
patent: 4066517 (1978-01-01), Stevens et al.
patent: 4278514 (1981-07-01), Morrissey
patent: 4339311 (1982-07-01), Branik

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