Palladium plating procedure and bath

Chemistry: electrical and wave energy – Processes and products

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Details

204 47, C25D 352, C25D 534

Patent

active

042996708

ABSTRACT:
A process for electrodepositing palladium. The article to be coated is exposed to a benzotriazole compound for preventing interference by copper ions in the plating bath. The article may be exposed either by a predip in a solution comprising a benzotriazole compound or the compound may be included in the electroplating bath.

REFERENCES:
patent: 1921941 (1933-08-01), Powell et al.
patent: 1970950 (1934-08-01), Wise
patent: 1981715 (1934-11-01), Atkinson
patent: 1993623 (1935-03-01), Raper
patent: 2452308 (1948-10-01), Lambros
patent: 3150065 (1964-09-01), Fatzer
patent: 3458409 (1969-07-01), Hayashi et al.
patent: 3544435 (1970-12-01), Angus et al.
patent: 3920526 (1975-11-01), Caricchio et al.

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