Palladium plating

Chemistry: electrical and wave energy – Processes and products

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C25D 350

Patent

active

046221107

ABSTRACT:
An electroplating bath composition is disclosed which permits high speed palladium deposition. The bath comprises carbonate or phosphate anion in a critical amount and is otherwise additive free. A pH of 7-9 is used.

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"Bath for Preparation of Silver-Palladium Alloys," IBM Technical Disclosure Bulletin, vol. 7, No. 3, Aug., 1964.

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