Palladium-nickel alloy electroplating and solutions therefor

Details Palladium-nickel alloy electroplating and solutions therefor Palladium-nickel alloy electroplating and solutions therefor

1981-09-18

1984-01-31

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 356

Patent

active

044288026

ABSTRACT:
A palladium-nickel alloy plating solutions formed from tetramminepalladous chloride is provided. The tetramminepalladous chloride is soluble in aqueous ammonia plating solution and is also water soluble. This permits replenishment of the palladium in a palladium-nickel plating solution during plating operation merely by adding the tetramminepalladous palladius chloride as a solid which is easily dissolved. The palladium-nickel alloy plating solutions contain between about 5 to 30 g/l of palladium and 5 to 30 g/l of nickel.

REFERENCES:
patent: 3580820 (1971-05-01), Yamamura et al.
patent: 3933602 (1976-01-01), Henzi et al.
patent: 4297177 (1981-10-01), Fletcher et al.

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