Palladium, gallium and copper-free alloy having high thermal exp

Dentistry – Prosthodontics – Tooth construction

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4332001, 148422, 148430, 148442, 420425, 420426, 420427, 420505, 420507, 420510, 420511, 420512, 420580, C22C 502, C22C 504, C22C 506, C22C 2702

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054236800

ABSTRACT:
A dental alloy is provided which is free of palladium, gallium and copper and which is compatible with a wide variety of composites and porcelain compositions. The alloy has a melting range of between about 870.degree. C. and 1230.degree. C. and a coefficient of thermal expansion of between 15.5.times.10.sup.-6 and 17.5.times.10.sup.-6 in/in/.degree. C. when heated from room temperature to 500.degree. C. The alloy contains between about 40 and 80 percent by weight gold, between 5 and 50 percent by weight of thermal expansion adjuster, between two and 15 percent by weight strengthener and oxide former, up to about 1.5 percent by weight grain refiner, and up to about 0.25 percent by weight deoxidizer.

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patent: 4201577 (1980-05-01), Ingersoll et al.
patent: 4297266 (1981-10-01), Ibsen et al.
patent: 4604366 (1986-08-01), Kacicz et al.
patent: 5221207 (1993-06-01), Schoeck et al.
patent: 5276068 (1994-01-01), Waknine

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