Palladium electroplating bath, process, and preparation

Details Palladium electroplating bath, process, and preparation Palladium electroplating bath, process, and preparation

1974-04-19

1976-01-20

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 43N, 204 47, 423 22, 423351, 423512, C25D 350, C25D 352, C25D 356

Patent

active

039336026

ABSTRACT:
Disclosed is an aqueous plating bath suitable for obtaining electrodeposits of palladium and its alloys. The bath is substantially free of cyanide, nitrate and nitrite, and comprises sulfite ion, palladium in the form of a tetra-coordinated complex with palladium in the +2 oxidation state, an atomic ratio of halide to palladium not in excess of 10, and exhibits a pH of from 7 to 12.

REFERENCES:
patent: 1921941 (1933-08-01), Powell et al.
patent: 2452308 (1948-10-01), Lambros
patent: 3150065 (1964-09-01), Fatzer
patent: 3458409 (1969-07-01), Hayashi et al.
patent: 3544435 (1970-12-01), Angus et al.
patent: 3637474 (1972-01-01), Zuntini et al.
patent: 3677909 (1972-07-01), Yamamura et al.
Frederick A. Lowenheim, "Modern Electroplating", p. 434, (1968).

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