Metal fusion bonding – Process – With pretreating other than heating or cooling of work part...
Patent
1990-11-05
1992-02-11
Rowan, Kurt
Metal fusion bonding
Process
With pretreating other than heating or cooling of work part...
228 563, 428570, 428643, 428670, B23K 3102
Patent
active
050869663
ABSTRACT:
A body formed of a lead-tin solder alloy is pretreated to deposit palladium thereon prior to soldering to a metallic substrate. It is found that the palladium deposit enhances wetting of the substrate by the solder liquid during reflow and thereby, upon cooling, produces a strong metallurgical bond. In a preferred embodiment, lead-tin solder balls are pretreated by applying tin-palladium colloidal particles and dissociating the particles to form a discontinuous metallic palladium deposit.
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Amercian Society for Metals, "Welding, Brazing and soldering", Metals Handbook, 9th edition, vol. 6 (1983) pp. 1069-1101.
Beckenbaugh William
Melton Cynthia M.
Raleigh Carl J.
Scheifers Steven
Fekete Douglas D.
Mah Chuck Y.
Motorola Inc.
Rowan Kurt
Southard Donald B.
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