Palladium and palladium alloy plating

Details Palladium and palladium alloy plating Palladium and palladium alloy plating

1986-01-21

1987-12-29

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 47, C25D 352, C25D 356

Patent

active

047159359

ABSTRACT:
The difficulties associated with electroplating palladium metal or alloy deposits from palladium diammino dichloride, palladium diamino dinitrite and palladium triammino sulphite baths can be avoided by plating from palladium baths containing oxalate. The palladium and oxalate may be in a single complex, such as palladium diamino oxalate, (Pd(NH.sub.3).sub.2 C.sub.2 O.sub.4), palladium tetraamino oxalate (Pd(NH.sub.3).sub.4 C.sub.2 O.sub.4) or an ammonium or alkali metal salt of palladium dioxalate (M.sub.2 Pd(C.sub.2 O.sub.4)).sub.2), where M represents an ammonium or alkali metal cation.
Alloying metal ions may also be present, as may an electrolyte, a brightener and/or a stress reducer.

REFERENCES:
patent: 2469727 (1949-05-01), Hoffman
patent: 3530050 (1970-09-01), Hill et al.
patent: 4430172 (1984-02-01), Brugger et al.
patent: 4487665 (1984-12-01), Miscioscio
patent: 4545869 (1985-10-01), Goldman
F. R. Hartley, "The Chemistry of Platinum and Palladium", p. 186, (1973).
Frederick G. Mann et al., J. Chem. Soc., pp. 1642-1652, (1935).

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