Palladium alloy plating compositions

Details Palladium alloy plating compositions Palladium alloy plating compositions

1995-02-21

1996-09-03

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

205250, 205255, 205257, 106105, 106123, 106124, 106126, 106128, C25D 362, C25D 356

Patent

active

055520316

ABSTRACT:
A palladium alloy plating composition comprising 4 to 20 g/l of palladium ion, 0.3 to 2.0 g/l of gold ion, 5 to 100 g/l of a conductive salt and 0.5 to 20 g/l of a complexing agent, and optionally 0.3 to 5 g/l of an alloying metal ion provides a plating with an excellent solderability and flexibility onto a substrate by an electrical plating method.

REFERENCES:
patent: 4741818 (1988-05-01), Nobel et al.
patent: 4911798 (1988-12-01), Abys et al.

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