Pagewidth printhead assembly having LCP micromolding

Details Pagewidth printhead assembly having LCP micromolding Pagewidth printhead assembly having LCP micromolding

2010-05-11

2011-12-13

Stephens, Juanita D (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S071000

Reexamination Certificate

active

08075093

ABSTRACT:
A pagewidth inkjet printhead assembly includes a printhead integrated circuit; an LCP ink manifold; and a flex PCB wire-bonded to bond pads on the printhead integrated circuit. The flex PCB wraps around the LCP ink manifold. The ink manifold includes an LCP lower micromolding having a plurality of ink inlets and an LCP upper micomolding having a plurality of ink outlets. The printhead integrated circuit is bonded to the LCP upper micromolding.

REFERENCES:
patent: 4528575 (1985-07-01), Matsuda et al.
patent: 5148194 (1992-09-01), Asai et al.
patent: 5869595 (1999-02-01), Fuller et al.
patent: 6151049 (2000-11-01), Karita et al.
patent: 6315384 (2001-11-01), Ramaswami et al.
patent: 6341845 (2002-01-01), Scheffelin et al.
patent: 6488355 (2002-12-01), Nakamura et al.
patent: 6824083 (2004-11-01), Okuda et al.
patent: 7066573 (2006-06-01), Silverbrook et al.
patent: 7722162 (2010-05-01), Silverbrook et al.
patent: 7775631 (2010-08-01), Silverbrook et al.
patent: 7794065 (2010-09-01), Silverbrook et al.
patent: WO 01/02172 (2001-01-01), None
patent: WO 01/42022 (2001-06-01), None

Affiliated with

Also associated with

Rating

Pagewidth printhead assembly having LCP micromolding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pagewidth printhead assembly having LCP micromolding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pagewidth printhead assembly having LCP micromolding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4314693