Padless plated vias having soldered wicks for multi-layer printe

Details Padless plated vias having soldered wicks for multi-layer printe Padless plated vias having soldered wicks for multi-layer printe

1984-07-02

1985-12-03

Grimley, A. T.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361414, H05K 100

Patent

active

045567590

ABSTRACT:
A multi-layer printed circuit board (21) has through holes (15-17) which are plated without conventional pads. This avoids circuit board rejections which would occur from cosmetic defects resulting from incomplete solder coverage of the pads and from pad lifting. In order to provide the through holes (15-17) with an adequate supply of solder during solder operations, wicks (45) are provided for each through hole (15-16) which is isolated from circuit traces (37, 38) on the exterior surface (33) of the printed circuit board (21). If the through hole (17) is connected to a circuit trace (38) on the exterior surface (33), then a connecting run (48) is used to provide wicking action in lieu of a tab (45).

REFERENCES:
patent: 3429038 (1969-02-01), Dugan et al.
patent: 3447960 (1969-06-01), Tonozzi
patent: 3508330 (1970-04-01), Kubik
patent: 3888639 (1975-06-01), Hastings et al.
patent: 4298770 (1981-11-01), Nishihara et al.
Joe Keller, Lifted Plated Through Holes-Yea or Nay? Printed Circuit Fabrication, Nov. 1983, pp. 98 and 100.

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