Padded clamp ring with edge exclusion for deposition of...

Details Padded clamp ring with edge exclusion for deposition of... Padded clamp ring with edge exclusion for deposition of...

2011-04-19

2011-04-19

Kackar, Ram N. (Department: 1716)

Coating apparatus

Gas or vapor deposition

Work support

C118S725000, C118S724000, C156S345510, C156S345520, C156S345530

Reexamination Certificate

active

07927424

ABSTRACT:
A substrate clamp ring has an edge exclusion lip with a variable bottom surface. At least a portion of that bottom surface has a height above the substrate contact level selected to minimize accumulation over time of deposited aluminum-copper alloy across lower portions of the bottom surface, and to allow the aluminum-copper alloy to be deposited to a thickness of at least 2 microns on each of a predetermined number of substrates without bridging. The height of the bottom surface at an innermost edge of the lip is preferably about 17 mils, while a height of the bottom surface over the substrate edge is preferably about 8.5 mils.

REFERENCES:
patent: 5810931 (1998-09-01), Stevens et al.
patent: 6162336 (2000-12-01), Lee
patent: 09143716 (1997-06-01), None
patent: 2002134413 (2002-05-01), None

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