Pad with indentations surface mount

Details Pad with indentations surface mount Pad with indentations surface mount

1997-01-21

2000-05-30

Sough, Hyung-Sub

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361767, H05K 116

Patent

active

060693231

ABSTRACT:
A surface mount pad and a component to be soldered onto the pad includes a main portion and two extension portions coupled to the main portion. The surface mount pad has an indentation which is defined by the extension portions. The portions extend from the main portion on opposing sides of the indentation. The extension portions are positioned to extend from underneath the component lead. The indentation extends underneath the component lead.

REFERENCES:
patent: 2758256 (1956-08-01), Eisler
patent: 2850681 (1958-09-01), Horton
patent: 3096466 (1963-07-01), Gossard
patent: 3519890 (1970-07-01), Ashby
patent: 3697668 (1972-10-01), Campbell
patent: 4980802 (1990-12-01), Champagne et al.
patent: 5401910 (1995-03-01), Mandai et al.
patent: 5426266 (1995-06-01), Brown et al.
patent: 5598867 (1997-02-01), Greenwood et al.

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