Pad tape surface polishing method and apparatus

Abrading – Abrading process – Utilizing fluent abradant

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Details

451 59, 451168, 451306, 451307, 451310, 451393, 451396, B24B 100, B24B 2100

Patent

active

060685425

ABSTRACT:
A surface polishing method comprises allowing a holder to hold a flat sheet-like workpiece, placing a pad tape in a location opposite to the holder, the pad tape consisting of a tape substrate and grains bonded to the substrate surface, supplying free grains between the holder and the pad tape, and rotating the holder and/or a mechanism holding the tape, thereby causing the free grains to polish the workpiece. An apparatus for practicing the method comprises a holder capable of holding a flat sheet-like workpiece, a tape holding mechanism located opposite to the surface of the workpiece and carrying a pad tape which consists of a tape substrate and grains bonded to the substrate, a rotary mechanism for rotating the holder and/or the tape holding mechanism, and an abrasive supplying mechanism for supplying free grains between the surface of the workpiece and the pad tape. The apparatus may further comprise a tape conveying mechanism for feeding the pad tape intermittently and/or a rocking mechanism for rocking the holder or the tape holding mechanism. The rotary mechanism maybe designed to cause eccentric motion or planetary motion of the holder.

REFERENCES:
patent: 3668814 (1972-06-01), Freerks et al.
patent: 3906678 (1975-09-01), Roth
patent: 5276999 (1994-01-01), Bando
patent: 5575707 (1996-11-01), Talieh et al.
patent: 5593344 (1997-01-01), Weldon et al.
patent: 5722877 (1998-03-01), Meyer et al.

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