Pad on pad type contact interconnection technology for electroni

Details Pad on pad type contact interconnection technology for electroni Pad on pad type contact interconnection technology for electroni

1994-07-15

1996-09-24

Paumen, Gary F.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439493, H01R 2366

Patent

active

055585230

ABSTRACT:
A pad on pad type contact, and technology therefor, for electronic apparatus wherein a spring member, that by its shape and material in the motion when the contact comes together wipes the mating pad surfaces across each other and then retains them under permanent compressive force in service. In high density and high performance electronic apparatus interwiring, array quantities of the spring member of contact are fabricated in unitary assembly elements for connection assemblies between both rigid and flexible type wiring.

REFERENCES:
patent: 3963315 (1976-06-01), Bonis
patent: 4169641 (1979-10-01), Olsson
patent: 4252389 (1981-02-01), Olsson
patent: 4509098 (1985-04-01), Das Gupta et al.
patent: 4509099 (1985-04-01), Takamatsu et al.
patent: 4740867 (1988-04-01), Roberts et al.
patent: 4948374 (1990-08-01), Carter
Wanek, D. J.-Research Disclosure, Apr. 1990, No. 312 RO 888-0349-Flex Cable Solderless Connector.
IBM Tech Disc. Bulletin vol. 18 No. 11 Apr. 1976 P3588 Ward, W. C.-Solderless Module to Circuit Connection.

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