Abrading – Abrading process – With tool treating or forming
Reexamination Certificate
2007-11-30
2010-06-08
Morgan, Eileen P. (Department: 3723)
Abrading
Abrading process
With tool treating or forming
C451S443000
Reexamination Certificate
active
07731569
ABSTRACT:
A pad conditioning apparatus and method for conditioning a surface of a polishing pad which is used in a polishing apparatus for polishing works, having a bending or deflecting or elastic member and a supporting section to support a base end of the bending or deflecting or elastic member, wherein the bending or deflecting or elastic member elastically deforms upon contact of a vicinity of a tip end of the bending or deflecting or elastic member with the polishing pad, so that a pressure necessary to condition the pad is generated. A pad preparation apparatus using the pad conditioner; and a pad preparation method using the same, enable even conditioning of a polishing pad of an elastic body by following a surface of the polishing pad.
REFERENCES:
patent: 5525100 (1996-06-01), Kelly et al.
patent: 5885147 (1999-03-01), Kreager et al.
patent: 6126533 (2000-10-01), Johnson et al.
patent: 6623344 (2003-09-01), Inaba
patent: 6953390 (2005-10-01), Sakurai et al.
patent: 2003/0134580 (2003-07-01), Sakurai et al.
patent: 2003/0190874 (2003-10-01), So
patent: 2005/0282477 (2005-12-01), Butterfield et al.
patent: 2006/0035568 (2006-02-01), Dunn
patent: 2006/0046623 (2006-03-01), Wang et al.
patent: 2006/0105680 (2006-05-01), Jeong
patent: 61-180644 (1986-08-01), None
patent: 62-184972 (1987-11-01), None
patent: 7-100749 (1995-04-01), None
patent: 10-315117 (1998-12-01), None
patent: 10-329003 (1998-12-01), None
patent: 2000-79551 (2000-03-01), None
patent: 2002-515833 (2002-05-01), None
patent: 2003-181756 (2003-07-01), None
Japanese Office Action Dated November 5, 2007 Issued for the Corresponding Japanese Application and Enclose the Japanese Office Action With the English Translation Thereof.
Morgan Eileen P.
Roberts Mlotkowski Safran & Cole P.C.
Safran David S.
Tokyo Seimitsu Co. Ltd.
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