Pad conditioner, pad conditioning method, and polishing...

Abrading – Abrading process – With tool treating or forming

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C451S443000

Reexamination Certificate

active

07731569

ABSTRACT:
A pad conditioning apparatus and method for conditioning a surface of a polishing pad which is used in a polishing apparatus for polishing works, having a bending or deflecting or elastic member and a supporting section to support a base end of the bending or deflecting or elastic member, wherein the bending or deflecting or elastic member elastically deforms upon contact of a vicinity of a tip end of the bending or deflecting or elastic member with the polishing pad, so that a pressure necessary to condition the pad is generated. A pad preparation apparatus using the pad conditioner; and a pad preparation method using the same, enable even conditioning of a polishing pad of an elastic body by following a surface of the polishing pad.

REFERENCES:
patent: 5525100 (1996-06-01), Kelly et al.
patent: 5885147 (1999-03-01), Kreager et al.
patent: 6126533 (2000-10-01), Johnson et al.
patent: 6623344 (2003-09-01), Inaba
patent: 6953390 (2005-10-01), Sakurai et al.
patent: 2003/0134580 (2003-07-01), Sakurai et al.
patent: 2003/0190874 (2003-10-01), So
patent: 2005/0282477 (2005-12-01), Butterfield et al.
patent: 2006/0035568 (2006-02-01), Dunn
patent: 2006/0046623 (2006-03-01), Wang et al.
patent: 2006/0105680 (2006-05-01), Jeong
patent: 61-180644 (1986-08-01), None
patent: 62-184972 (1987-11-01), None
patent: 7-100749 (1995-04-01), None
patent: 10-315117 (1998-12-01), None
patent: 10-329003 (1998-12-01), None
patent: 2000-79551 (2000-03-01), None
patent: 2002-515833 (2002-05-01), None
patent: 2003-181756 (2003-07-01), None
Japanese Office Action Dated November 5, 2007 Issued for the Corresponding Japanese Application and Enclose the Japanese Office Action With the English Translation Thereof.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Pad conditioner, pad conditioning method, and polishing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pad conditioner, pad conditioning method, and polishing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pad conditioner, pad conditioning method, and polishing... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4247532

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.