Pad conditioner of CMP equipment

Details Pad conditioner of CMP equipment Pad conditioner of CMP equipment

2005-11-01

2005-11-01

Nguyen, George (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S056000, C451S072000, C451S443000

Reexamination Certificate

active

06960114

ABSTRACT:
A pad conditioner of wafer planarization equipment includes a linear driving device for moving a disk holder up and down using a magnetic force. The linear driving device has an electromagnet, a permanent magnet, and a controller. The controller controls the power supplied to the electromagnet such that the electromagnet and permanent magnet produce a force of attraction and/or repulsion used to move the disk holder relative to a polishing pad of the wafer planarization equipment.

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patent: 6036583 (2000-03-01), Perlov et al.
patent: 6234868 (2001-05-01), Easter et al.
patent: 6322434 (2001-11-01), Satoh et al.
patent: 2000-18620 (2000-04-01), None

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