Pad conditioner for chemical mechanical polishing apparatus

Details Pad conditioner for chemical mechanical polishing apparatus Pad conditioner for chemical mechanical polishing apparatus

1997-07-18

1999-05-18

Eley, Timothy V.

Abrading

Accessory

Dressing

451 41, 451 56, 451165, 451910, B24B21/18

Patent

active

059046155

ABSTRACT:
A pad conditioner for a chemical mechanical polishing (CMP) apparatus which is adapted to remove a glazing phenomenon occurring on a polishing pad when wafers are machined using the CMP apparatus. The pad conditioner includes a swing arm pivotally mounted at one end thereof to a desired portion of the upper surface of the chemical mechanical polishing apparatus by a pivot shaft, a rotating oscillator coupled to the other end of the swing arm and adapted to horizontally rotate a conditioning tool mounted thereto while vertically oscillating the conditioning tool, the rotating oscillator including a rotating unit for horizontally rotating the conditioning tool and an oscillation generating unit for vertically oscillating the conditioning tool, and a vertical carrier unit coupled to the other end of the swing arm and adapted to vertically move the rotating oscillator. The pad conditioner finely removes particles of a slurry glazed in voids formed in the surface of a pad by high-frequency oscillations, thereby achieving an extension of the pad life and an improvement in polishing efficiency.

REFERENCES:
patent: 5245796 (1993-09-01), Miller et al.
patent: 5547471 (1996-08-01), Breivogel et al.
patent: 5643067 (1997-07-01), Katsuoka et al.
patent: 5688364 (1997-11-01), Sato
"New Polishing Techniques for Plantarization of VLSI Device Wafers"; H. Jeong et al.; 1st International ABTEC Conference; Seoul, Nov. 1993; pp. 80-85.

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