Pad conditioner

Abrading – Machine – Stationary tool

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Details

451 56, 451443, 451444, 451242, B24B 5300

Patent

active

057795266

ABSTRACT:
Polishing apparatus cuts and shapes a polishing pad to produce a polishing surface which minimizes pad runout and which can be contoured to better achieve desired polishing rates, pressures, and performance with respect to selected areas on a semiconductor wafer being processed with the polishing pad.

REFERENCES:
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5456630 (1995-10-01), Kaiser et al.
patent: 5486131 (1996-01-01), Cesna et al.
patent: 5531635 (1996-07-01), Mogi et al.
patent: 5547417 (1996-08-01), Breivogel et al.

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