Pad array socket

Geometrical instruments

Patent

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Details

220259, 339 17CF, H01R 909, H01R 2372

Patent

active

045027471

ABSTRACT:
The present invention relates to a chip carrier socket having two opposing hinged frames, one to clamp and positively latch the other against the carrier. More particularly the socket contains a plurality of contact elements with generally horizontally extending contact surfaces to engage the carrier pads. The hinged frames include one having a double spring construction for bearing against the carrier and another having extended arms overlying the first frame and clamping it against the carrier.

REFERENCES:
patent: 1050265 (1913-01-01), Crone
patent: 2016606 (1935-10-01), Krueger
patent: 3568129 (1971-03-01), Gold et al.
patent: 3737067 (1973-06-01), Palson
patent: 3846737 (1974-11-01), Spaulding
patent: 4278311 (1981-07-01), Scheingold et al.
patent: 4376560 (1983-03-01), Olsson
IBM Bulletin, Bruder, vol. 13, No. 5, p. 1265, 10-1970.

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