Pad array socket

Details Pad array socket Pad array socket

1992-05-19

1993-12-28

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439 67, H01R 909

Patent

active

052734404

ABSTRACT:
A pad array socket for use in mechanically and electrically connecting a high density pad array integrated circuit carrier to a printed circuit substrate. The socket comprises a flexible circuit, a molded elastomeric spring member, a frame, and a cover. The frame defines a cavity. The elastomeric spring member is placed at the bottom of the cavity. The flexible circuit is placed directly over the elastomeric spring member. An integrated circuit carrier is placed into the cavity upon the flexible circuit. The cover is then secured over the assembly, thereby applying downward pressure on the integrated circuit carrier. The spring member applies upward pressure to the flexible circuit, thereby causing the electrical contacts of the flexible circuit to come into contact with the electrical contacts of the integrated circuit carrier. The flexible circuit includes leads that extend from the socket and which may be soldered to the substrate, thereby mechanically securing the socket to the substrate and providing electrical contact between the socket and the substrate.

REFERENCES:
patent: 4554505 (1985-11-01), Zachry
patent: 4658331 (1987-04-01), Berg
patent: 4783719 (1988-11-01), Jamison et al.
patent: 5059129 (1991-10-01), Brodsky et al.
patent: 5158467 (1992-10-01), Grabbe et al.

Affiliated with

Also associated with

Rating

Pad array socket does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pad array socket, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pad array socket will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1538988