Pad arrangement for surface mount components

Details Pad arrangement for surface mount components Pad arrangement for surface mount components

1993-08-30

1995-09-26

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361767, 361768, 361808, H05K 102

Patent

active

054535816

ABSTRACT:
A pad arrangement (100) for aligning and attaching a surface mount component (402) with other circuitry includes a substrate (102) upon which opposing pads (108) are attached. Each of the pads occupies a substantially rectangular area (110) having four sides. In order to facilitate alignment of the surface mount component the substantially rectangular area has two opposing flat sides an outwardly extending arcuate area (112) along at least one of the other two sides.

REFERENCES:
patent: 4551788 (1985-11-01), Daniel et al.
patent: 4558812 (1985-12-01), Bailey et al.
patent: 4835345 (1989-05-01), Haarde
patent: 4870225 (1989-09-01), Anao et al.
patent: 4878611 (1989-11-01), LoVasco et al.
patent: 5011066 (1991-04-01), Thompson
patent: 5303122 (1994-04-01), Adams, Jr. et al.

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