Pad and electronic device employing the same

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S770000, C361S742000, C361S758000

Reexamination Certificate

active

11033315

ABSTRACT:
The present invention discloses a pad and an electronic device employing the same, wherein the pad has an accommodating groove, a ditch disposed around the periphery of the accommodating groove, and at least one guiding groove disposed between the ditch and the accommodating groove, and one end of the guiding groove coupled to the ditch and the other end coupled to the accommodating groove; such that if a glue for attaching the pad with an electronic device is melted by heat, the melted glue will flow into the ditch, and thus can achieve the effects of preventing the melted glue flowing out from the body as well as guiding and collecting the melted glue within the body.

REFERENCES:
patent: 5879115 (1999-03-01), Medal
patent: 6603656 (2003-08-01), Cho et al.
patent: 2002/0043608 (2002-04-01), Nakata et al.

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