Packs of laminations and method and apparatus for forming them

Inductor devices – Core joint structure – Overlapping laminations

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29609, 29738, 336234, H01F 2724

Patent

active

054062438

ABSTRACT:
Complementary packs of laminations (41, 43) are provided for use in an electromagnetic device, the laminations in different layers having legs of length that alternates according to a predetermined pattern. The lamination of one pack (41) can fit into the laminations of another pack (43) which has legs alternating according to a complementary pattern. The packs (41, 43) can be push-fitted together about a bobbin (45) to form an interleaved stack of laminations for a transformer or other electromagnetic device. A method and apparatus for forming the stacks are also described.

REFERENCES:
patent: 3213727 (1965-10-01), Schwennesen
Patent Abstracts of Japan, vol. 6, No. 185 for Japanese Patent Publication No. 57-99718.
Patent Abstracts of Japan, vol. 12, No. 221 for Japanese Patent Publication No. 63-16607.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Packs of laminations and method and apparatus for forming them does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packs of laminations and method and apparatus for forming them, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packs of laminations and method and apparatus for forming them will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1541424

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.