Inductor devices – Core joint structure – Overlapping laminations
Patent
1991-08-26
1995-04-11
Hall, Carl E.
Inductor devices
Core joint structure
Overlapping laminations
29609, 29738, 336234, H01F 2724
Patent
active
054062438
ABSTRACT:
Complementary packs of laminations (41, 43) are provided for use in an electromagnetic device, the laminations in different layers having legs of length that alternates according to a predetermined pattern. The lamination of one pack (41) can fit into the laminations of another pack (43) which has legs alternating according to a complementary pattern. The packs (41, 43) can be push-fitted together about a bobbin (45) to form an interleaved stack of laminations for a transformer or other electromagnetic device. A method and apparatus for forming the stacks are also described.
REFERENCES:
patent: 3213727 (1965-10-01), Schwennesen
Patent Abstracts of Japan, vol. 6, No. 185 for Japanese Patent Publication No. 57-99718.
Patent Abstracts of Japan, vol. 12, No. 221 for Japanese Patent Publication No. 63-16607.
Hirst Trevor
Jenkins Peter R.
Goldberg Richard M.
Hall Carl E.
Linton & Hirst Limited
LandOfFree
Packs of laminations and method and apparatus for forming them does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packs of laminations and method and apparatus for forming them, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packs of laminations and method and apparatus for forming them will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1541424