Packing material and method of making same

Stock material or miscellaneous articles – Coated or structually defined flake – particle – cell – strand,... – Particulate matter

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523209, 523216, 428391, B32B 516

Patent

active

052983285

ABSTRACT:
A packing material for sealing electronic devices having improved, higher thermal conductivity than amorphous silica-containing packing material. The packing material comprises a thermosetting resin and a filler particle comprising a core inorganic particle and an amorphous silica coating on the core particle. The core particle is made from material having a thermal conductivity higher than that of amorphous silica, for example, a metal nitride such as aluminum nitride or silicon nitride, or a metal oxide such as aluminum oxide, or crystalline silicon dioxide. The amorphous silica coating may be formed by hydrolysis of alkoxysilane.

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