Packing box for lead terminal type semiconductor product

Details Packing box for lead terminal type semiconductor product Packing box for lead terminal type semiconductor product

1994-06-21

1995-12-26

Sewell, Paul T.

Special receptacle or package

Holder for a removable electrical component

Including component positioning means

206722, 206591, 206594, B65D 7302

Patent

active

054779669

ABSTRACT:
A packing device for semiconductor devices with lead terminals includes a packing box, partitions for separating a space in the packing box, and a cover. A conductive sponge used as a cushioned packing material is attached to the back surface of the cover. The semiconductor devices are placed in the packing box 3 with the lead terminals 2 facing upwardly. In this packed state, the conductive sponge is pressed against the lead terminals to collectively hold the semiconductor devices securely in the box. Thus, short-circuitting of the lead terminals is made to prevent gate of the semiconductor devices from breaking down as a result of electrostatic voltage.

REFERENCES:
patent: 2214230 (1940-09-01), Freeburg
patent: 2518450 (1950-08-01), Cowen et al.
patent: 3092245 (1963-06-01), Poisson
patent: 3421679 (1969-01-01), Goldman
patent: 3631297 (1971-12-01), Conner
patent: 3847274 (1974-11-01), Inglish et al.
patent: 4129213 (1978-12-01), Fleig
patent: 4241829 (1980-12-01), Hardy
patent: 4333565 (1982-06-01), Woods
patent: 4496627 (1985-01-01), Azuma
patent: 4573574 (1986-03-01), Connery
patent: 4790433 (1988-12-01), Raszewsi
patent: 4977483 (1990-12-01), Perretta

Affiliated with

Also associated with

Rating

Packing box for lead terminal type semiconductor product does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packing box for lead terminal type semiconductor product, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packing box for lead terminal type semiconductor product will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1363204