Packaging unit for semiconductor wafers

Details Packaging unit for semiconductor wafers Packaging unit for semiconductor wafers

1984-11-05

1985-11-26

Dixson, Jr., William T.

Special receptacle or package

For plate or sheet

Fragile or sensitive

206334, 206564, 206586, B65D 8530, B65D 5700, B65D 8100

Patent

active

045550247

ABSTRACT:
A three-component tray-type packaging unit for semiconductor wafers, compatible with automatic equipment, includes a wafer carrier enclosed between a tub-shaped lower portion for receiving the wafer carrier and a matching lid. The wafers are fixed at four contact points-namely, in the wafer carrier by two rows of spring tongues arranged tangentially with respect to the wafer, and in the matching lid by two rows of inwardly projecting retention cones.

REFERENCES:
patent: 4043451 (1977-08-01), Johnson
patent: 4061228 (1977-12-01), Johnson
patent: 4160504 (1979-07-01), Kudlich et al.
patent: 4450960 (1984-05-01), Johnson

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