Packaging techniques for optical transmitters/receivers

Details Packaging techniques for optical transmitters/receivers Packaging techniques for optical transmitters/receivers

1989-02-01

1990-03-27

Sikes, William L.

350 9615, G02B 636

Patent

active

049115197

ABSTRACT:
Advanced packaging techniques are utilized to provide updated packaging for optical transmitters and receivers. In particular, the hybrid integrated circuit (HIC) used to form either the transmitter or receiver circuitry in the prior art has been replaced by a plastic dual-in-line package (DIP). The DIP includes specialized leads (prongs) formed through the short end of the DIP to provide direct connection to the optical device. These end-prong leads thus significantly decrease the parasitic capacitance associated with conventional DIP connections. A capacitor may be molded into the DIP across the power supply leads to provide filtering for the package. Thermal dissipation is provided by two separate means in this package. First, the leadframe of the DIP is formed to include relatively long leads which extend through the bottom of the package to carry away the heat generated by the integrated circuit and the DIP itself may be disposed on a thermally conductive substrate which will also dissipate heat generate by the integrated circuit. Second, the metal cover of the package is attached to the optical device by a thermally conductive epoxy to provide a heat path for the optical device. Molded plastic piece parts are utilized to form the optical sleeve and an optical frame assembly.

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Holden, LED Array Package for Optical Data Links, The Bell System Technical Journal, Mar. 1979, pp. 713-720.

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