Packaging technique for antenna systems

Details Packaging technique for antenna systems Packaging technique for antenna systems

2007-09-04

2007-09-04

Chen, Shih-Chao (Department: 2821)

Communications: radio wave antennas

Antennas

Microstrip

C343S893000

Reexamination Certificate

active

11382908

ABSTRACT:
A modular electronic architecture is provided. In particular, one or more unit sub-arrays providing at least a portion of the antenna radiator elements and supporting circuitry comprising at least part of a phased array antenna are provided. Each unit sub-array includes a first area comprising a rigid circuit board on which one or more antenna radiator elements are formed. In addition, a second area of rigid circuit board material for supporting circuitry is provided. The first and second areas are interconnected to one another by a region of flexible circuit board material having connective traces. Methods for forming unit sub-arrays providing antenna radiator elements and supporting circuitry are also provided. More particularly, a completed unit sub-array may be formed while the associated circuit boards are in a flat or planar condition. Following any desired verification of the operating status of the circuit board, supporting structure can be machined away, allowing the unit sub-array to be folded for inclusion in a phased array antenna assembly.

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