Packaging system for semiconductor devices

Details Packaging system for semiconductor devices Packaging system for semiconductor devices

2008-01-29

2008-01-29

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S127000, C438S123000, C257S673000, C257S666000, C257SE23039

Reexamination Certificate

active

07323361

ABSTRACT:
A package system for integrated circuit (IC) chips and a method for making such a package system. The method uses a solder-ball flip-chip method for connecting the IC chips onto a lead frame that has pre-formed gull-wing leads only on the source/gate side of the chip. A boschman molding technique is used for the encapsulation process, leaving exposed land and die bottoms for a direct connection to a circuit board. The resulting packaged IC chip has the source of the chip directly connected to the lead frame by solder balls. As well, the drain and gate of the chip are directly mounted to the circuit board without the need for leads from the drain side of the chip.

REFERENCES:
patent: 4653993 (1987-03-01), Boschman
patent: 5202849 (1993-04-01), Nozaki
patent: 5844315 (1998-12-01), Melton et al.
patent: 5925934 (1999-07-01), Lim
patent: 6077724 (2000-06-01), Chen
patent: 6337510 (2002-01-01), Chun-Jen et al.
patent: 6717260 (2004-04-01), Pavier et al.
patent: 2003/0025183 (2003-02-01), Thornton et al.
patent: WO 03/083908 (2003-10-01), None

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