Packaging system for semiconductor burn-in

Details Packaging system for semiconductor burn-in Packaging system for semiconductor burn-in

1980-07-07

1982-09-28

Larson, Lowell A.

Metal working

Means to assemble or disassemble

Means to assemble electrical device

206328, 324158F, H05K 1304

Patent

active

043511082

ABSTRACT:
This invention relates generally to burn-in apparatus and methods for stressing the physical and electrical limits of electronic components under controlled environmental and load conditions and more particularly to a system for temporarily packaging a plurality of semiconductors such that they can be connected to a common electrical input while under controlled environmental conditions including extremes of temperature. The invention has special utility in the handling of integrated circuit devices of the dual-in-line packaging type.

REFERENCES:
patent: 3235797 (1966-02-01), Boscia et al.
patent: 3237761 (1966-03-01), Madden
patent: 3454154 (1969-07-01), Peters et al.
patent: 3701077 (1972-10-01), Kelly
patent: 3733672 (1973-05-01), Bohannon
patent: 4178545 (1979-12-01), Kneifel

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