Packaging system for multiple semiconductor devices

Details Packaging system for multiple semiconductor devices Packaging system for multiple semiconductor devices

1987-11-04

1988-08-09

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 75, 357 70, 361415, H01L 2302

Patent

active

047631880

ABSTRACT:
An improved high density packaging system for interconnecting integrated circuit devices includes a tin alloy lead frame sandwiched between two multi-layer glass/epoxy substrates encapsulated in an injection molded plastic/epoxy package. Integrated circuit devices are mounted on the top of the upper substrate and on the bottom of the lower substrate to provide increased packaging density.

REFERENCES:
patent: 3564114 (1967-02-01), Blinder et al.
patent: 4322778 (1982-03-01), Barbour et al.

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