Packaging system for a standard electronic module

Details Packaging system for a standard electronic module Packaging system for a standard electronic module

1993-06-21

1994-10-25

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257728, 333246, 361761, 361792, H05K 720

Patent

active

053594886

ABSTRACT:
A packaging system for a standard electronic module is provided utilizing a multi-layer, low temperature, co-fired ceramic motherboard. Device packages, such as an RF device package, are formed of low temperature, low dielectric, co-fired ceramic materials. The device packages are mounted on a composite heat sink provide on one side of the motherboard. A pressure plate provide on the opposite side of the motherboard is fastened to the heat sink to compress the device package. Pressure contact interconnects are used to make contacts between the device packages and the particular conductor layer in the multilayer motherboard. The radio frequency conductor layer in the motherboard is isolated from power and control layers by ground planes provided in the motherboard.

REFERENCES:
patent: 4899118 (1990-02-01), Poliaski, Sr.
patent: 5023624 (1991-06-01), Heckman
patent: 5132648 (1992-07-01), Triah
patent: 5150088 (1992-09-01), Virga

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