Package making – Methods – Forming or partial forming a receptacle and subsequent filling
Patent
1994-02-04
1997-02-18
Sipos, John
Package making
Methods
Forming or partial forming a receptacle and subsequent filling
53471, 53485, 206471, B65B 4700
Patent
active
056032013
ABSTRACT:
A blister package, method for forming the same, and backing sheet for use therewith, wherein the package includes: i) a planar backing sheet having one or more die-cut portions, a series of spaced score lines formed in the backing sheet adjacent each die-cut portion, the material of the backing sheet adjacent each die-cut portion being folded upwardly out of the plane of the backing sheet about a first score line, folded laterally about a second score line, and folded downwardly about a third score line to form at least one hollow projection extending out of the plane thereof; ii) a vacuum-formed clear plastic blister pack cover having at least one compartment formed therein for containing product(s) to be packaged, and one or more projections formed therein complemental in shape, number and location to the folded hollow projection(s) formed in the backing sheet; iii) the backing sheet and cover being disposed in face-to-face relation with the product(s) to be packaged disposed therebetween within the compartment.
REFERENCES:
patent: 3347733 (1967-10-01), Elver
patent: 3399763 (1968-09-01), Stone
patent: 3406492 (1968-10-01), Ludwig
patent: 3430411 (1969-03-01), Ollier
patent: 3864892 (1975-02-01), Molvar
patent: 3997052 (1976-12-01), Eddy et al.
patent: 4047358 (1977-09-01), Heffernan et al.
patent: 4495749 (1985-01-01), Faller
patent: 4777780 (1988-10-01), Holzwarth
Cameron Rodney L.
LaFata John E.
Ritter Brett D.
Cassidy, P.S. J. Robert
Sipos John
Tolan Ed
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