Packaging system

Package making – Methods – Forming or partial forming a receptacle and subsequent filling

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

53471, 53485, 206471, B65B 4700

Patent

active

056032013

ABSTRACT:
A blister package, method for forming the same, and backing sheet for use therewith, wherein the package includes: i) a planar backing sheet having one or more die-cut portions, a series of spaced score lines formed in the backing sheet adjacent each die-cut portion, the material of the backing sheet adjacent each die-cut portion being folded upwardly out of the plane of the backing sheet about a first score line, folded laterally about a second score line, and folded downwardly about a third score line to form at least one hollow projection extending out of the plane thereof; ii) a vacuum-formed clear plastic blister pack cover having at least one compartment formed therein for containing product(s) to be packaged, and one or more projections formed therein complemental in shape, number and location to the folded hollow projection(s) formed in the backing sheet; iii) the backing sheet and cover being disposed in face-to-face relation with the product(s) to be packaged disposed therebetween within the compartment.

REFERENCES:
patent: 3347733 (1967-10-01), Elver
patent: 3399763 (1968-09-01), Stone
patent: 3406492 (1968-10-01), Ludwig
patent: 3430411 (1969-03-01), Ollier
patent: 3864892 (1975-02-01), Molvar
patent: 3997052 (1976-12-01), Eddy et al.
patent: 4047358 (1977-09-01), Heffernan et al.
patent: 4495749 (1985-01-01), Faller
patent: 4777780 (1988-10-01), Holzwarth

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Packaging system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaging system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging system will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1595600

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.